Memory Process Patents
“Semiconductor process” refers to processes that are used by manufacturers to fabricate semiconductor devices, including memory process and logic process patents.
Conversant owns important patents specifically related to the fabrication of semiconductor memory devices. Our Memory Process patents were selected and acquired from the world’s top semiconductor memory manufacturers, and apply primarily to the processes and structures used to fabricate state-of-the-art DRAM and Flash memory devices.
Logic Process Patents
Conversant’s Logic Process patent portfolio includes patents related to the manufacture of the semiconductor devices that are used at the heart of digital products such as personal computers and smartphones.
Our patents cover: Front End-Of-Line (FEOL) processes and structures related to active devices, such as transistors, capacitors and resistors; and Back End-Of-Line (BEOL) patents related to the metal interconnection of devices and dielectric layers. A significant portion of the Logic portfolio deals with the advanced technologies used in state-of-the-art devices such as the High-K Metal Gate (HKMG) and 3D transistor or FinFET.
Complementing our Memory and Logic portfolios, our Packaging portfolio comprises patents related to the final stage of fabricating an integrated circuit, in which the semiconductor device is encased in a protective container.
Conversant’s Packaging patents cover various types of widely used packaging technologies, including Ball Grid Array (BGA), flip-chip, and System-in-Package (SiP). The patents also cover emerging packaging technologies such as 3D IC, in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit.